Global and United States Electronic Packaging Materials Market - Industry Perspective, Comprehensive Analysis, and Forecast, 2027

 Published: Jul-2019 |  Format: PDF | HeyReport |  Number of pages: 120

Summary Electronic packaging materials are used to carry electronic components and their interconnection, Function as mechanical support, seal environmental protection, heat dissipation of electronic components and so on. Electronic packaging materials have good electrical insulation, it is the sealing material of an integrated circuit.  Market Segment as follows: By Type Metal Packages Plastic Packages Ceramic Packages By Application Semiconductor & IC PCB Others By Company DuPont Evonik EPM Mitsubishi Chemical Sumitomo Chemical Mitsui High-tec Tanaka Shinko Electric Industries Panasonic Hitachi Chemical Kyocera Chemical Gore BASF Henkel AMETEK Electronic Toray Maruwa Leatec Fine Ceramics NCI Chaozhou Three-Circle Nippon Micrometal Toppan Dai Nippon Printing Possehl ... Read more
Table of Content
Table of Contents
1 Market Overview
    1.1 Market Segment Overview
        1.1.1 Product Definition
        1.1.2 Market by Type
            1.1.2.1 Metal Packages
            1.1.2.2 Plastic Packages
            1.1.2.3 Ceramic Packages
        1.1.3 Market by Application
            1.1.3.1 Semiconductor & IC
            1.1.3.2 PCB
            1.1.3.3 Others
    1.2 Global and Regional Market Size
        1.2.1 Global Overview
        1.2.2 United States Overview
2 Global and Regional Market by Company
    2.1 Global
        2.1.1 Global Sales by Company
        2.1.2 Global Price by Company
    2.2 United States
        2.2.1 United States Sales by Company
        2.2.2 United States Price by Company
3 Global and Regional Market by Type
    3.1 Global
        3.1.1 Global Sales by Type
        3.1.2 Global Price by Type
    3.2 United States
        3.2.1 United States Sal...

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